METHOD FOR MANUFACTURING SEMICONDUCTOR COMPONENT, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor component capable of providing a laminated structure with a plurality of semiconductor components overlapped, and to provide a semiconductor device with the semiconductor component laminated.

SOLUTION: The method for manufacturing the semiconductor component for dividing the semiconductor wafer 1 into individual semiconductor elements 1a comprises the steps of forming a groove 1d for half cutting the wafer 1 on the surface opposite to the circuit forming surface, dividing the wafer 1 into individual piece by covering except an opening 12 having a width wider than the groove 1d by a mask 11 and providing an isotropic etching to the opening 12 by a fluorine plasma, and forming a step part 1e with an outer edge of the semiconductor elements 1a removed by the concave shape cross section having the removing thickness d by removing the range to be etched in a concave cross section by the predeterined removing depth d. The steps 1e is used as a runout space of the connection part for a wire bonding.

COPYRIGHT: (C)2008,JPO&INPIT