| 摘要 |
A semiconductor device includes a wiring board having a wiring pattern, a semiconductor chip that has an integrated circuit and is mounted on a first surface of the wiring board to electrically connect with the wiring pattern, a spacer that is disposed on a second surface of the wiring board and has inside thereof an electronic component that is electrically connected with the wiring pattern and an external terminal that is disposed on the second surface and electrically connected with the wiring pattern. |
