SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PLACING TABLE

摘要

A film forming apparatus is provided with a processing container (2) for storing a semiconductor wafer (W); a substrate placing table (5) arranged inside the processing container (2) for placing the semiconductor wafer (W); a shower head (40) arranged at a position facing the placing table (5) as a processing gas blowing mechanism for blowing out a processing gas into the processing container (2); and an exhauster (101) for exhausting inside the processing container (2). The substrate placing table (5) is provided with a placing table main body (5a), and a heat blocking body (200), which is arranged on the placing table main body (5a) in a region outside a region where the semiconductor wafer (W) is placed, and reduces heat diffusion from the placing table main body to the shower head (40).