PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING SAME, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

摘要

Disclosed is a photosensitive resin composition characterized by containing (A) a binder polymer, (B) a photopolymerizable compound having at least one or more polymerizable ethylenically unsaturated bonds in a molecule, (C) a photopolymerization initiator, and (D) a compound represented by the following general formula (1). [Chemical formula 1] (1) In the formula (1), R<SUP>1</SUP>, R<SUP>2</SUP>, R<SUP>3</SUP> and R<SUP>4</SUP> independently represent a hydrogen atom or a group represented by the following general formula (2). [Chemical formula 2] (2) In the formula (2), R<SUP>5</SUP> represents a hydrocarbon group having 4-30 carbon atoms.