| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate flattening device compact in foot print, which is thins and flattens a substrate by grinding, polishing and working a back surface of the semiconductor substrate in high throughput. <P>SOLUTION: The substrate flattening device 10 is provided with: a grinding work stage 20 furnished with a substrate storage stage 13 indoor and arranging substrate holders 30a, 30b, 30c of a member constituting an articulated type carrier robot 14, a temporary placing base 15 for positioning, a moving carrier pad 16 and three stages of a substrate loading/unloading stage S<SB>1</SB>, rough grinding stage S<SB>2</SB>and, a finishing grinding stage S<SB>3</SB>, on a concentric circle on a first index type rotating table 2 on a base 11 indoor; and a polishing work stage 70 arranging a substrate holder table 70a constituting a substrate loading/unloading finishing polishing stage ps<SB>1</SB>, and a substrate holder table 70b constituting a rough polishing stage ps<SB>2</SB>on a concentric circle on a second index type rotating table 71. <P>COPYRIGHT: (C)2008,JPO&INPIT |
