发明名称 CONDUCTIVE MEMBER FOR SEMICONDUCTOR DEVICE, PACKAGE FOR SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF THEM
摘要 <P>PROBLEM TO BE SOLVED: To provide a conductive member for a semiconductor device which can prevent reduction of a reflection efficiency in the vicinity of a light source by preventing discoloration of a metal plated lead provided in the vicinity of a semiconductor element. <P>SOLUTION: In the semiconductor device having a lead 11 built therein, the lead 11 is electrically connected to a semiconductor element, at least part of the lead is sealed with a light transmitting resin 14 containing a metal salt compound, a region of the at least a part of the lead in the vicinity of the resin 14 contains a metal smaller in standard electrode potential than the metal of the metal salt compound, and the region of the at least the part of the lead in the vicinity of the resin 14 is covered with a compound having an electron donor group. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007266349(A) 申请公布日期 2007.10.11
申请号 JP20060090040 申请日期 2006.03.29
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 YAMADA SATOYUKI
分类号 H01L23/28;H01L33/44;H01L33/56;H01L33/62 主分类号 H01L23/28
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