| 摘要 |
PROBLEM TO BE SOLVED: To safely convey a wafer without causing any damage on it when the wafer is conveyed from a process of removing an external circumferential reinforcing portion to a process of singulating semiconductor chips. SOLUTION: After a necessary portion (at least a circular convex portion 6) of the external circumferential reinforcing portion 5a is removed, the wafer 1 is not immediately separated from a chuck table 201 in order to conveying the wafer 1 to a subsequent process. While the wafer 1 is held in the chuck table 201, a dicing tape 31 supported by a dicing frame 32 is stuck on the rear surface of the wafer, and then, the wafer 1 is separated from the chuck table 201 via the dicing frame 32. Then, the wafer 1 is conveyed to a semiconductor chip singulating process. COPYRIGHT: (C)2008,JPO&INPIT |
