| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is excellent in productivity and also excellent in moldability such as flowability and curability, package heat releasability, and other reliability, and to provide an electronic part device having an element sealed with the resin composition. SOLUTION: This epoxy resin composition comprises (A) an epoxy resin having structures represented by a general formula (I) (R<SB>1</SB>to R<SB>8</SB>are each independently identically or differently H, a 1 to 10C hydrocarbon group or a 1 to 10C alkoxy group), (B) a curing agent represented by a specific general formula (IIa) to (IId) (not shown), and (C) an inorganic filler. COPYRIGHT: (C)2008,JPO&INPIT |
