| 摘要 |
PROBLEM TO BE SOLVED: To provide an underfilling method of semiconductor devices which makes it possible to control the amount of supply of an underfill material as precisely as possible. SOLUTION: Prior to the mounting of a semiconductor device on a printed-wiring board 11, a fluid 35 of an ultraviolet curing resin is supplied from a nozzle 21 toward the surface of the printed-wiring board 11. When a specified quantity of fluid 35 is spouted out, the fluid is irradiated with ultraviolet rays from a penetrating aperture 26 formed in the nozzle 21. In the fluid exposed to the ultraviolet rays, a solidification reaction occurs. By this solidification reaction, the viscosity of the fluid is increased. By a partial increase in the viscosity, a partition is formed for the fluid inside the nozzle 21. Between the partition and the fluid 35 spouted out from the tip of the nozzle 21, the fluid is interrupted comparatively easily. Accordingly, it is possible to control the quantity of supply of the fluid spouted out from the nozzle with high precision, by adjusting the interruption of the fluid in this way. COPYRIGHT: (C)2008,JPO&INPIT
|
