| 摘要 |
PROBLEM TO BE SOLVED: To provide a normal-temperature bonding apparatus which has long service life and is compact and low in cost. SOLUTION: The normal-temperature bonding apparatus is provided with a bonding chamber 2 to generate vacuum atmosphere, a gate valve 5 to open/close between a loadlock chamber 3 and the bonding chamber 2, a conveyance mechanism 8 to convey upper and lower substrates to the bonding chamber 2 from the loadlock chamber 3 by means of the gate valve 5, and an ion gun 32 to apply particles to the surface of the upper substrate to be bonded at normal temperature and the surface of the lower substrate to be bonded at normal temperature, in vacuum atmosphere. In this case, the ion gun 32 is directed toward an area excluding the gate valve 5 among the inner surface of the bonding chamber 2. The normal-temperature bonding apparatus 1 is protected from contamination of gate valve 5, so that it has longer service life. COPYRIGHT: (C)2008,JPO&INPIT
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