| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing process of a copper cladding laminate in which handleability in laminate manufacturing is improved, microfabrication of at most 30μm pitch is possible, and which is excellent in flexibility and a foldability resistance. SOLUTION: The manufacturing process of the copper cladding laminate by which an insulating layer made of an insulating resin is formed in one surface of a copper foil, is characterized by using a rolling copper foil with a thickness of 10μm or more as the copper foil, applying a polyimide precursor resin solution to one surface of this copper foil directly, then forming a polyimide resin insulating layer by heat treating at 100-400°C, and carrying out chemical polishing of the surface which is not in contact with the insulating layer of the obtained laminate with a liquid which contains 0.5-10% of hydrogen peroxide and the range of concentration (wt.%) of 0.5-15% of sulfuric acid so that the thickness of the copper foil is removed in the range of 10-90%, and its surface roughness Rz becomes 2.5μm or less. COPYRIGHT: (C)2008,JPO&INPIT
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