发明名称 A TEST STRUCTURE AND METHOD FOR DETECTING CHARGE EFFECTS DURING SEMICONDUCTOR PROCESSING USING A DELAYED INVERSION POINT TECHNIQUE
摘要 A semiconductor process test structure comprises a gate electrode, a charge-trapping layer, and a diffusion region. The test structure is a capacitor-like structure in which the charge-trapping layer will trap charges during various processing steps. A CV measurement can then be used to detect whether a Vfb shift has occurred. If the process step resulted in a charge effect, then the induced charge will not be uniform. If the charging of the test structure is not uniform, then there will not be a Vfb shift. A delayed inversion point technique can then be used to monitor the charging status.
申请公布号 US2007236237(A1) 申请公布日期 2007.10.11
申请号 US20060279224 申请日期 2006.04.10
申请人 MACRONIX INTERNATIONAL CO., LTD. 发明人 KUO MING-CHANG;LEE MING-HSIU;WU CHAO-L
分类号 G01R31/26 主分类号 G01R31/26
代理机构 代理人
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