DEVICE SUBSTRATE WASHING METHOD

摘要

Disclosed is a device substrate washing method which can fully remove a resist attached to a device substrate, particularly a resist attached to a perforated part of a fine pattern which has a large aspect ratio. The method comprises a washing step for removing a resist attached to a device substrate with a solvent, wherein the solvent is a composition comprising at least one fluorinated compound selected from the group consisting of hydrofluoroether, hydrofluorocarbon and perfluorocarbon and a fluorinated alcohol.