| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having high reliability capable of reducing a warpage of a support body in which a sealing member is disposed. <P>SOLUTION: The semiconductor device includes a support body 100 in which a pair of first conductors 101a, 101b and a pair of second conductors 102a, 102b different from the first conductors 101a, 101b are disposed on an insulating substrate 100a; and a sealing member 112 that covers a semiconductor element disposed on the support body 100. The support body 100 has an insulator formed by exposing the insulating substrate between the pair of first conductors, and at least one of the pair of second conductors is disposed at a side of the insulator, and the sealing member is disposed on an area including at least a part of the area of the first conductor or the second conductor. <P>COPYRIGHT: (C)2008,JPO&INPIT |
