| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for controlling a removable rate of material from a substrate during a polishing process. <P>SOLUTION: In this method, a pre-polish profile of the substrate is determined, and a conditioning parameter of a polishing pad is adjusted on the basis of the profile. A parameter such as a conditioning head sweep range or a frequency, and conditioning elements of downforce and a rotational speed are adjusted such that conditioning is selectively performed to a portion of the pad to maintain optimum polishing capability of the pad. <P>COPYRIGHT: (C)2008,JPO&INPIT |
