发明名称 CLEANING METHOD OF REACTIVE ION ETCHING (RIE) DEVICE, AND REACTIVE ETCHING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a cleaning method of a reactive ion etching (RIE) device and the reactive etching device, whereby electrodes and the barrier plates in the vicinity of electrodes can be automatically cleaned without exposing them to the atmosphere when cleaning the electrodes. <P>SOLUTION: The electrode 01 facing a base material 10 (exhausted when cleaning) and the earthed electrode 02 facing the electrode 01 are disposed in a vacuum, argon gas is introduced into the vicinity of the electrodes, and a high frequency is impressed. If a gap between the electrodes 01, 02 is widened by a lifting mechanism 05 and an aligning mechanism 06, the area of the electrode facing the electrode 01 is formed so as to include the earthed electrode 02 and barrier plates 07, and the area ratio of both electrodes varies. As a result, a self-bias value impressed in the vicinity of the base material and the facing electrodes is adjusted, and adhering contaminants are removed by sputtering. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007265727(A) 申请公布日期 2007.10.11
申请号 JP20060087443 申请日期 2006.03.28
申请人 TOPPAN PRINTING CO LTD 发明人 NAKAJIMA TAKAYUKI
分类号 H05H1/46 主分类号 H05H1/46
代理机构 代理人
主权项
地址