发明名称 MODULATED MULTI-TAPE LAPPING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a modulated multi tape lapping device which facilitates addition and elimination of a shoe assembly, a polishing material-coated tape and a tape holder in response to a change of the number of machining positions of the outer surface or the inner surface of a machined material without remodeling the whole of a unit including a dedicated series of several shoe assemblies, the polishing material-coated tape, and the tape holder. SOLUTION: There are integrally assembled as a replaceable arm module 20: a cassette main body 1 fitted to a pair of straight moving slides 11 and 12, which are respectively fixed to a machine main body 10, freely to move in a Z-axis direction toward the machined material; a pair of opening/closing arms 6 and 6, which are arranged around an arm opening/closing shaft fitted to the cassette main body 1, freely to open and close; shoe assemblies 5 and 5 having a pair of relatively rigid recessed surfaces for pushing the polishing material-coated tape by bringing the polishing material-coated tape supported by the pair of opening/closing arms 6 and 6 in contact with a shaft surface 4 of the machined material 2; and an arm opening/closing clamp cylinder 7. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007260812(A) 申请公布日期 2007.10.11
申请号 JP20060087119 申请日期 2006.03.28
申请人 NACHI FUJIKOSHI CORP 发明人 AKIZUKI HIROSAKU;FUJII HIROSHI
分类号 B24B21/00;B24B21/06 主分类号 B24B21/00
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