| 摘要 |
A micro-electro mechanical system (NEMS) device, such as a MEMS switch ( 100 ), includes a package seal ( 104 ) bonded to a substrate ( 102 ), wherein an electrode 106 (e.g., an actuation electrode associated with a switch) is provided on an inner surface ( 103 ) of the package seal ( 104 ). The MEMS switch ( 100 ) might include, for example, a central switch structure implementing a double-pole, single-throw switch using a push-pull arrangement of internal activation electrodes ( 106, 108 ). The central switch structure might include a cantilevered moveable actuation electrode ( 122 ) or an electrode supported in two or more peripheral regions.
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