| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit apparatus capable of suppressing the deterioration of the reliability caused by the difference in environmental temperature. SOLUTION: A first transistor Tr1 and a first resistor R1 connected in series thereto are arranged on a first wiring layer 2. An insulating layer 3 is provided to cover the first transistor Tr1 and the first resistor R1. Here, the insulating layer 3 is a resin film to which a heat transmission promoting filler is added. Further, a second wiring layer 6 having a predetermined wiring pattern is provided on the insulating layer 3. A second transistor Tr2 and a second resistor R2 connected in series thereto are provided on this second wiring layer 6. In this case, the second transistor Tr2 is located above the first transistor Tr1 and the second resistor R2 is located above the first resistor R1 so that they are disposed in laminated arrangements, respectively. COPYRIGHT: (C)2008,JPO&INPIT
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