| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer-polishing apparatus and method, which can control the thrust of a wafer to be a desired value all over the surface, particularly, can control the thrust of the edge part of the wafer locally to be the desired value, and can maintain the quality of the wafer. <P>SOLUTION: The wafer-polishing apparatus holds a wafer W by a holder head 14, and pushes the wafer against a polishing pad 20 and polishes it through the holder head. The holder head is equipped with a carrier to push the wafer against the polishing pad, a retainer ring arranged in the perimeter of the carrier, a plurality of toric elastic members arranged concentrically on the underside of the carrier, and an air supply line to supply pressurized gas to the air chamber in the interior of the elastic member, wherein the zone rubber ring 52D of the outermost periphery is arranged at the position to press the marginal part of the wafer, the pressing plane 53A is formed so that the pressing distribution is formed in the radial direction of the wafer. <P>COPYRIGHT: (C)2008,JPO&INPIT |
