| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve film thickness detection precision of a terminal point detection monitor and to terminate polishing when a face to be polished becomes an optimum state. <P>SOLUTION: In a polishing device, a surface of a substrate 2 held by a top ring 3 is slidably brought into contact with a polishing pad 4 covering a surface of a polishing table 1. Sensor holes 30 passing through the polishing table 1 and the polishing pad 4 are formed in the polishing table 1 and the polishing pad 4. A sensor 36 of the terminal point detection monitor 40 is arranged inside the sensor hole 30 so that a sensor head 34 of the sensor 36 is brought close to the substrate 2 during polishing. <P>COPYRIGHT: (C)2008,JPO&INPIT |
