| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To manufacture a wiring board having excellent electrical properties, a high reliability, etc. by forming a via hole having a good shape surely and efficiently by irradiating a laser on an interlayer insulation layer on a composite base material. <P>SOLUTION: In a designing stage using a CAD device 201, a product name is added as base material identification information to existing data 218 for forming a via hole which includes positional information and dimensional information. A laser processing device 202 fetches the data 218 for forming a via hole, and changes settings of laser irradiation conditions of a laser unit 220 based on the product name included in the data 218. By irradiating a laser 224 based on the laser irradiation conditions in the laser processing device 202, a via hole is formed in a resin insulation layer of the wiring board 10. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
