| 摘要 |
PROBLEM TO BE SOLVED: To provide a machining method of a sheet wafer and a holder of a sheet wafer capable of preventing the destruction of the sheet wafer by holding the sheet wafer without applying any force. SOLUTION: The holder 100 in a piezoelectric wafer 16 as one example of the sheet wafers comprises: a recess 19 formed on a base body 10, a window opening section 15 penetrating the bottom of the recess 19, and a locking section 18 provided on an upper surface 12 in the base body 10 so that it is locked to the recess 19. The piezoelectric wafer 16 is freely inserted into the recess 19 and is machined while the jump-out is prevented by the locking section 18. COPYRIGHT: (C)2008,JPO&INPIT |
