| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive composition for a flexible printed circuit, having excellent tin-plating resistance, a cover-lay film using the same, an adhesive sheet, a copper-clad laminate and a lead frame fixing tape. SOLUTION: The adhesive composition for a flexible printed circuit comprises (A) an epoxy resin, (B) a thermoplastic resin, (C) an inorganic filler and (D) an imidazole compound represented by general formula (I) (R<SP>1</SP>is hydrogen or a 1-20C alkyl group; R<SP>2</SP>is hydrogen, a vinyl group or a 1-5C alkyl group; R<SP>3</SP>, R<SP>4</SP>, R<SP>5</SP>and R<SP>6</SP>may be each the same or different and a 1-10C saturated hydrocarbon group; X<SP>1</SP>and X<SP>2</SP>may be the same or different and are each hydrogen, an amino group, a carboxy group, an epoxy group, a hydroxy group, a methylol group, an isocyanate group, a vinyl group, a silanol group or a 1-3C alkyl group; p and q are each an integer of 1-10; l is an integer of 1-3; and r is an integer of 1-5). COPYRIGHT: (C)2008,JPO&INPIT |
