| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a grounding mechanism capable of further reducing a quantity of particles adhering to a substrate, and to provide an apparatus equipped with the mechanism. <P>SOLUTION: The substrate grounding mechanism 210 is provided with a plate spring 216, extending in parallel with a substrate surface toward the substrate 101; and a blade 214 connected to the tip end of the plate spring 216 and contacting the substrate 101 to make it conduct. They are arranged so that the contacting position where the blade 214 contacts the substrate 101 when the plate spring 216 is not elastically deformed, and the arrangement position of the plate spring 216 can be substantially the same in a direction orthogonal to the substrate surface. Thus, the quantity particles that adhere to the substrate 101 can be reduced. <P>COPYRIGHT: (C)2008,JPO&INPIT |
