发明名称 METHOD FOR MANUFACTURING PLATE-LIKE HEAT TRANSMITTING TUBE AND PACKAGE UNIT
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a plate-like heat transmitting tube which is excellent in sealing and is used for cooling a device and a package unit. SOLUTION: A package unit 2 for cooling is composed of a first frame 21 and a second frame 22. The first frame has a first joining portion 212 enclosing an operation area 211 and a supporting portion 213 protruded between the operation area and the first joining portion, and the second frame has a cover portion 221, which covers the first frame and forms a holding chamber holding a capillary structure 3 and cooling fluid on the operation area, and a second joining portion 222 positioned on the first joining portion. In a joining matter, such as a cream solder, between the first joining portion and the second joining matter, when the first and second frames are heated being joined together, to join the first joining portion and the second joining portion, the melted cream solder and solvent are blocked by a protruded supporting portion and does not come into the holding chamber. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007266542(A) 申请公布日期 2007.10.11
申请号 JP20060093067 申请日期 2006.03.30
申请人 KIKO KAGI KOFUN YUGENKOSHI 发明人 YANG HSIU-WEI;CHEN PEI-PEI;YU WEN-HWA;WU JR-HUA;JENG JAU-SHIANG
分类号 H01L23/427 主分类号 H01L23/427
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