发明名称 METAL-BASE CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND LED MODULE
摘要 PROBLEM TO BE SOLVED: To provide a bendable metal-base circuit board having a good electromagnetic wave shielding property while ensuring heat dissipation and electric insulation, and to provide a manufacturing method thereof and an LED module using it. SOLUTION: In this metal-base circuit board a conductor circuit is provided on metal foil via an insulating layer, and further a cover-lay, a layer having a magnetic loss, or a layer having a dielectric loss is provided. This metal-base circuit board is characterized in that a slit formed by removing at least a part of the cover-lay is formed in a portion wherein the conductor circuit is not provided. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007266204(A) 申请公布日期 2007.10.11
申请号 JP20060087688 申请日期 2006.03.28
申请人 DENKI KAGAKU KOGYO KK 发明人 OKAJIMA YOSHIHIKO;OKADA TAKUYA
分类号 H05K1/05;H05K1/02;H05K3/28;H05K9/00 主分类号 H05K1/05
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