| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor-sealing epoxy resin composition that can reduce the formation of package crack even in solder reflow treatment under high-temperature conditions, and to provide a semiconductor device. SOLUTION: The semiconductor-sealing epoxy resin composition is obtained by melt blending (A) an epoxy resin, (B) a phenolic resin having a structure expressed by formula (1) (wherein, m is an integer of 1-10), (C) a phenolic resin composition having a biphenyl skeleton containing an amino silane coupling agent, and (D) an inorganic filler. COPYRIGHT: (C)2008,JPO&INPIT
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