发明名称 Methods of Fabricating Application Specific Integrated Circuit (ASIC) Devices that Include Both Pre-Existing and New Integrated Circuit Functionality and Related ASIC Devices
摘要 A method of fabricating a semiconductor integrated circuit, such as an ASIC, and a semiconductor integrated circuit using the same, are cost effective and allow lower non-recurring engineering compared with a platform ASIC by separately embodying a cell-based base block chip and a custom block chip of a gate array system and then combining both chips. When fabricating the semiconductor integrated circuit, formed by combining at least one standard function block with a newly-developed custom function block, the method of fabricating the semiconductor integrated circuit includes forming a base block chip that embodies the standard function block. Then, a custom block chip that embodies the custom function block is separately formed, and the base block chip is combined with the custom block chip.
申请公布号 US2007240092(A1) 申请公布日期 2007.10.11
申请号 US20070692987 申请日期 2007.03.29
申请人 SAMSUNG ELECTRONICS., LTD. 发明人 LEE YUN-TAE;PARK JONG-WOO;HWANG SEON-WOOK
分类号 G06F17/50;H03K19/00 主分类号 G06F17/50
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