| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power stack which allows biased presence of cooling efficiency to be suppressed, and is excellent in cooling balance. <P>SOLUTION: This power stack 1 alternately laminates a plurality of cooling pipes 2 which define a cooling path for flowing a refrigerant inside thereof respectively, and a plurality of semiconductor modules 940, 950. Both sides of the respective semiconductor modules 940, 950 in the laminated direction are brought into surface contact with the cooling pipes 2. The plurality of semiconductor modules 940, 950 can be classified into a plurality of groups mutually different in heating value, and the plurality of semiconductor modules 940, 950 are located so that a pair of semiconductor modules 940 belonging to a same group with the largest heating value do not adjoin each other in the laminated direction on both sides of any cooling pipe 2. <P>COPYRIGHT: (C)2008,JPO&INPIT |
