| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip package that has improved heat radiation properties, and can reduce costs and thickness and improve heat-resistant stress. <P>SOLUTION: The chip package comprises: a thin-film substrate 210 that has a groove 211, and comprises a pattern metal core layer 212 and surface dielectric layers 215, 216, where a plurality of internal fingers 213 and a plurality of pads 214 for circumscription are formed on the pattern metal core layer 212, and the internal finger 213 is arranged at the periphery of the groove 211; a chip 220 for forming a plurality of electrode edges 223 on an active surface 221, and adhering the active surface 221 to the thin-film substrate 210 when the electrode edges 223 are arranged toward the inside of the groove 211; a plurality of bonding wires 230 that are passed through the groove 211 and connect the electrode edge 223 and the internal finger 213 electrically; and a sealing body 240 that is formed on the thin-film substrate 210 and in the groove 211, and seals the chip 220 and the bonding wire 230. <P>COPYRIGHT: (C)2008,JPO&INPIT |
