| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To mitigate the non-uniformity of the intensity distribution by the interference pattern of laser beams. <P>SOLUTION: A laser beam machining apparatus comprises a pulse laser beam oscillator 1, a slit 40 for limiting the laser beam flux, an illumination optical system 30 for uniformly illuminate the slit and a phase shift part 20, and an imaging lens 5 for performing the reduced projection of the laser beams passed through the slit 40 on an object 6 for machining. The laser beam flux is partitioned by the phase shift part 20 to shift the phase in a superposing manner on the slit 40, and uniform machining without any interference pattern is performed by suppressing the interference of the unified laser beam flux. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
