发明名称 |
Light emitting diode package and light emitting diode |
摘要 |
In a light emitting diode package or a light emitting diode, a cover body having an opening with a reflecting surface is attached on an upper portion of a base body on which a light emitting diode element is mounted. The base body is formed of alumina ceramics having a pore diameter of 0.10 to 1.25 mum or a porosity of 10% or more, and a thermal via is formed in the base body. Accordingly, it is possible to improve luminance and heat radiating characteristics of the light emitting diode package and the light emitting diode which uses alumina ceramics.
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申请公布号 |
US2007235746(A1) |
申请公布日期 |
2007.10.11 |
申请号 |
US20060391679 |
申请日期 |
2006.03.29 |
申请人 |
MITSUYAMA KAZUMA;YAMAMOTO ITSUKI;KUDO KOUJI;FUKUMOTO NARIO;FUKAE HIROYUKI;NISHIYAMA KENGO;NARITA TAKUMI;KAWAGUCHI HIROKI |
发明人 |
MITSUYAMA KAZUMA;YAMAMOTO ITSUKI;KUDO KOUJI;FUKUMOTO NARIO;FUKAE HIROYUKI;NISHIYAMA KENGO;NARITA TAKUMI;KAWAGUCHI HIROKI |
分类号 |
H01L29/227;H01L29/24;H01L33/60;H01L33/62;H01L33/64 |
主分类号 |
H01L29/227 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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