发明名称 Propylene Resin Composition and Molding Thereof
摘要 To provide a propylene resin composition excellent in both the electroconductivity and moldability and excellent in their balance, and a molded product thereof. A propylene resin composition comprising from 50 to 98 wt % of a propylene resin having a MFR of from 5 to 300 g/10 min, and from 2 to 50 wt % of carbon black having a 24M4DBP absorption of at least 130 cm<SUP>3</SUP>/100 g, a dehydrogenation amount of at most 1.2 mg/g at 1,500° C. for 30 minutes and a crystallite size (Lc) of from 10 to 17 Å. A propylene resin molded product which is a propylene resin molded product obtained by molding such a propylene resin composition and which has a volume resistivity of from 10<SUP>2 </SUP>to 10<SUP>9 </SUP>Omega.cm and a MFR of from 1 to 80 g/10 min.
申请公布号 US2007238828(A1) 申请公布日期 2007.10.11
申请号 US20050592797 申请日期 2005.02.04
申请人 MITSUBISHI CHEMICAL CORPORATION 发明人 MATSUKI AKIHIRO;KANAMARU SHINICHI;FUKUYAMA YUTAKA;MISE NOBUTAKE;TAKAMURA EIHACHI;NAKAYAMA KOICHI
分类号 C08K7/06;C08L23/10;C08L53/00;C09C1/48;C09C1/50 主分类号 C08K7/06
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