| 摘要 |
An integrated circuit package system is provided providing an integrated circuit die having a final metal layer of the semiconductor process used to manufacture the integrated circuit die and a passivation layer provided thereon, depositing a first metal layer on the passivation layer and the final metal layer, forming an analog circuit in the first metal layer, coating a first insulation layer on the first metal layer and the passivation layer, exposing a first pad and a second pad of the first metal layer through the first insulation layer, and connecting a first interconnect on the first pad and a second interconnect on the second pad. |
