| 摘要 |
A heat radiation substrate and a method for manufacturing the same are provided to prevent products from being damaged due to a heat by radiating the heat generated from the products rapidly and efficiently. A heat radiation substrate includes a substrate(10), a first TiB2 layer(20), an insulation layer(30), a circuit pattern(40), a solder mask layer(50), a flux coating layer(60), a second TiB2 layer(70), a heat radiation pattern(80), and a cooling resin layer(90). The first TiB2 layer(20) is formed on an upper plane of the substrate(10). The insulation layer(30) is formed on the first TiB2 layer(20). The circuit pattern(40) is formed on the insulation layer(30). The solder mask layer(50) is formed on the insulation layer(30) having the circuit pattern(40), and exposes the circuit pattern partially. The flux coating layer(60) is formed on the partially exposed circuit pattern(40). The second TiB2 layer(70) is formed on a lower plane of the substrate(10). The radiation pattern(80) has a resin compound and a copper alloy ball formed on the second TiB2 layer(20). The cooling resin layer(90) is formed on a lower plane of the substrate(10) having the heat radiation pattern(80).
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