SUBSTRATE WITH BUILT-IN CHIP AND METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN CHIP

摘要

A method for manufacturing a substrate having a built-in chip is provided with a first step of mounting a semiconductor chip on a first substrate whereupon a first wiring is formed, and a second step of bonding a second substrate whereupon a second wiring is formed with the first substrate. In the second step, the semiconductor chip is sealed between the first substrate and the second substrate, the first wiring is electrically connected with the second wiring, and a multilayer wiring connected with the semiconductor chip is formed.