SENSOR CHIP MANUFACTURING METHOD AND SENSOR CHIP

摘要

There is provided a sensor chip manufacturing method for manufacturing a sensor chip including a substrate, a cover layer, a spacer layer arranged between the substrate and the cover layer, and a hollow reaction unit arranged in the spacer layer. The method includes a step for attaching two or more adhesive tapes to a sheet forming a plurality of substrates or to a plurality of substrates so as to form a spacer layer and forming a hollow reaction unit by a gap defined by one or more of the tapes. It is possible to reduce the volume irregularities and positional shifts of the hollow reaction units. A sensor chip manufactured by this method is also disclosed.