| 摘要 |
FIELD: electrical and instrumentation engineering, microelectronics. ^ SUBSTANCE: proposed epoxy resin based current-conducting adhesive composition characterized in high electric conductivity and high strength of glued joints at temperature ranging between -60 and +150 C, as well as in case of glued joint shear at temperatures of 20 to 150 C has following ingredients, parts by mass: nitrogen-containing epoxy resin, 100; curing agent (isomethyl tetrahydrophthalic anhydride or low-molecular polyamide), 40- 80; electricity-conducting filler (carbonic nickel), 416 - 475; aliphatic epoxy resin, 15 - 25; organic solvent, 15 - 25; (tris-2,4,6-dimethyl aminomethyl) phenol or mixture of lambda-aminopropyl triethoxysilane and beta-aminoisopropyl triethoxysilane isomers, 0.5 - 2.5. ^ EFFECT: enhanced strength and electric conductivity properties of adhesive composition. ^ 5 cl, 2 tbl |
