SENSOR CHIP MANUFACTURING METHOD AND SENSOR CHIP

摘要

A method for fabricating a sensor chip having a substrate, a cover layer, a spacer layer interposed between the substrate and the cover layer, and a hollow reaction section provided in the spacer layer, the method comprising the steps of: affixing two or more adhesive or bonding tapes onto a sheet where a plurality of substrates are to be formed or onto a plurality of substrates, to thus form a spacer layer; and forming a hollow reaction section from one or a plurality of gaps between the tapes, whereby volumetric variations or positional displacements of the hollow reaction section can be reduced. A sensor chip which can be fabricated by this method.