Electronics assembly having heat sink substrate disposed in cooling vessel

摘要

An electronics assembly (10) is provided having a housing (12) including walls defining a fluid vessel. One or more thermally conductive heat sink devices (20) extend through one or more openings (40) in the housing (12) and in thermal communication with a liquid coolant. One or more electronics devices (30) are mounted onto a mounting surface (22) of the heat sink devices (20) such that the electronics devices (30) are cooled by the liquid coolant in the fluid vessel.