PRINTED WIRING BOARD WITH COMPONENT-MOUNTING PIN

摘要

A printed wiring board is provided to reduce the occurrence of connecting defects caused by thermal expansion coefficients between a semiconductor chip and the print wiring board (4) even though a highly integrated semiconductor is mounted on the printed wiring board. The print wiring board (4) comprises a component-mounting pin (1) made of a metallic wire to connect with the semiconductor chip (10). The semiconductor chip (10) is a plate-mounting type semiconductor device used in a flip-chip manner with an electrode pad (3) formed on a mounting surface. The component-mounting pin (1) is formed by using a wire-bonding technique.