| 摘要 |
An electrostatic chuck is provided to prevent the inflow of plasma gas by installing a ring member for sealing the adhered part between a wafer supporting plate and a base plate. An electrostatic chuck includes a wafer supporting plate(10), a base plate(30), and an adhesive film. The supporting plate(10) supports a wafer. The base plate(30) radiates the heat of the wafer supporting plate(10). The adhesive film adheres the wafer supporting plate(10) and the base plate(30). The wafer supporting plate(10) is made of a ceramic material including Al2O3 and TiO2. The adhesive film is made of silicon. The electrostatic chuck further includes a ring member(20) for sealing the adhered part between the wafer supporting plate(10) and the base plate(30).
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