发明名称 CONCATENATED BODY OF SENSOR CHIPS AND MANUFACTURING METHOD THEREOF
摘要 In a concatenated body of sensor chips, adjacent sensor chips are concatenated in such a way that they can be separated. Each of the sensor chips can effectively be cut off and separated from the concatenated body and after the separation, the sensor chip can easily and rapidly be contained in a container. Furthermore, it is possible to easily inspect the sensor chips and exclude a defective chip. Each of the sensor chips includes a substrate, a cover layer, a hallow reaction unit arranged between the substrate and the cover layer, detection means arranged in the hollow reaction unit, an output terminal for outputting a signal detected by the detection means, and a sample introduction opening for introducing a sample into the hollow reaction unit. The manufacturing method of the concatenated body of sensor chips is also disclosed.
申请公布号 KR20070100311(A) 申请公布日期 2007.10.10
申请号 KR20077016732 申请日期 2007.07.20
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD.;NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCEAND TECHNOLOGY 发明人 KAIMORI SHINGO;HOSOYA TOSHIFUMI;ICHINO MORIYASU;NAKAMURA HIDEAKI;GOTOH MASAO;KURUSU FIMIYO;ISHIKAWA TOMOKO;KARUBE ISAO
分类号 G01N27/327;G01N35/02 主分类号 G01N27/327
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