MANUFACTURING METHOD OF MOLDING COMPOUND COMPRISING AN EPOXY RESIN FOR OPTICAL SEMICONDUCTOR DEVICE

摘要

A method for preparing an epoxy resin composition for molding an optical semiconductor device is provided to reduce the time required for the manufacturing process, thereby lowering the manufacturing cost and to improve the dispersion of a fluorescent material in an epoxy resin compound. A method for preparing an epoxy resin composition comprises the steps of (S21) mixing a phenolic epoxy resin, an acid anhydride type liquid curing agent and a liquid curing accelerator and reacting them; (S22) injecting a fluorescent material during the reaction to terminate the reaction and to form a first solid resin; (S23) pulverizing the first solid resin to prepare a first solid resin powder; (S24) adding an additive to the first solid resin powder and mixing them; (S25) mixing the mixture at 60-70 deg.C to prepare a second solid resin; (S26) cooling and pulverizing the second solid resin to prepare a second solid resin powder; and (S27) molding the second solid resin powder into a tablet.