发明名称 METHOD FOR FORMING AND COATING A SUBSTRATE
摘要 <p>A substrate(21) is formed in one cavity(13) of a twin cavity tool(10) and moved into a second cavity(14) of the same tool. A varnish coating(22) is then applied under pressure onto the substrate in the second cavity. Substrates(21) can be formed by injection molding, injection compression, foaming or reaction injection molding(RIM) methods. Varnish(22) systems have a solvent content of not >10%, preferably not >2%, more preferably not >1% and most preferably are solvent free. Varnish pot life is not >30, preferably not >10 and more preferably not >2minutes.</p>
申请公布号 EP1841579(A1) 申请公布日期 2007.10.10
申请号 EP20050817923 申请日期 2005.12.13
申请人 BAYER MATERIALSCIENCE AG 发明人 ZOELLNER, OLAF;JUST, THORSTEN;TILLACK, JOERG;HAUSSTAETTER, BERND;GLAWE, MICHAEL;KONEJUNG, KLAUS;LANG, STEFFEN
分类号 B29C37/00;B29C45/16;B29C67/24 主分类号 B29C37/00
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