Light emission device and corresponding manufacturing process

摘要

Described herein is a light-emission device comprising one or more solid-state sources, obtained by positioning light-emitting chips (13) on a substrate (11), including a package (15; 25) for protection from agents that coats said chips (13). According to the invention, said package (15; 25) comprises a plurality of elements for diffusion (26) of the light coming from said one or more light-emitting chips (13).