| 摘要 |
A semiconductor etching device is provided to suppress a sticking phenomenon by spraying helium gas through a lift pin in a de-chucking process. A cylinder body(40) includes upper and lower pressure chambers with a piston between them. A shaft is made in a tube-like shape and coupled with the piston. The shaft is protruded from the cylinder body and moves in a vertical direction. Plural lift pins(44) are integrated with the shaft and elevate wafers in the vertical direction. During a de-chucking process, the lift pins spray a helium gas to the wafer. A lift pin hole and a helium supply hole(46) are formed on an electrostatic chuck(50). A helium supply tube(48) is coupled with the helium supply hole. A first helium switch valve(49) is arranged on the helium supply tube and supplies the helium gas to the helium supply hole. A second helium switch valve(51) is arranged on the helium supply tube and supplies the helium gas to the lift pin.
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