| 摘要 |
A method of providing connections to a chip having contact pads on the surface thereof, comprising: locating a discrete solder element on each pad; and melting the discrete solder elements so as to cause each of them to adhere to the respective pad, thereby forming a solder bump extending from the surface of the chip; wherein the size of each discrete solder element relative to the area of the pad on which it is located is such that the height of each bump is less than 70% of the diameter of the solder element that formed it. |
