发明名称 |
PLASMA PROCESSING APPARATUS |
摘要 |
A plasma processing device is provided to increase the uniformity of a process by controlling the density of plasma to improve a yield. A plasma processing device includes a reaction chamber(100), an antenna(116), and a shower head(112) and a lower electrode(114). The reaction chamber(100) maintains airtight seal of a substrate processing region and is safety-grounded. A high-frequency transmitting window(120) is formed on a part of an upper side wall of the reaction chamber(100). The antenna(116) is formed on an outer circumferential surface of the reaction chamber(100). The antenna includes a slope of which upper portion is inclined inwardly to the reaction chamber(100). The shower head(112) and the lower electrode(114) are opposed to each other.
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申请公布号 |
KR20070099742(A) |
申请公布日期 |
2007.10.10 |
申请号 |
KR20060030858 |
申请日期 |
2006.04.05 |
申请人 |
RADIION TECH CO., LTD. |
发明人 |
CHUNG, SANG GON;SHIN, YOU SHIK;LEE, KYUNG HO |
分类号 |
H01L21/3065 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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