发明名称 PLASMA PROCESSING APPARATUS
摘要 A plasma processing device is provided to increase the uniformity of a process by controlling the density of plasma to improve a yield. A plasma processing device includes a reaction chamber(100), an antenna(116), and a shower head(112) and a lower electrode(114). The reaction chamber(100) maintains airtight seal of a substrate processing region and is safety-grounded. A high-frequency transmitting window(120) is formed on a part of an upper side wall of the reaction chamber(100). The antenna(116) is formed on an outer circumferential surface of the reaction chamber(100). The antenna includes a slope of which upper portion is inclined inwardly to the reaction chamber(100). The shower head(112) and the lower electrode(114) are opposed to each other.
申请公布号 KR20070099742(A) 申请公布日期 2007.10.10
申请号 KR20060030858 申请日期 2006.04.05
申请人 RADIION TECH CO., LTD. 发明人 CHUNG, SANG GON;SHIN, YOU SHIK;LEE, KYUNG HO
分类号 H01L21/3065 主分类号 H01L21/3065
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